PATTERN

The PATTERN project — an acronym for “Next-Generation Ultra-High-Speed Microwave Photonic integrATed circuiTs using advancEd hybRid iNtegration” — is a European research and innovation initiative funded under the EU Horizon Europe programme (Grant Agreement No. 101070506). Over a runtime of four years, the project aims to push the boundaries of photonic integrated circuit (PIC) technology by developing the world’s first Process and Assembly Design Kits (PDK & ADK) for microwave photonics at ultra-high frequencies above 100 GHz, along with entirely new methods for the heterogeneous integration of III-V gain materials and BiCMOS electronic drivers with advanced electro-optic platforms such as lithium niobate on insulator (LNOI).

At its core, PATTERN‘s vision is to integrate all major photonic functionalities onto a single hybrid chip. This involves designing novel building blocks such as acousto-optic modulators and magneto-optic isolators, developing wafer-scale heterogeneous integration techniques including flip-chip bonding and micro-transfer printing, and covering the full spectrum of manufacturing steps from design and simulation through to fabrication, packaging, and testing. The practical capabilities of the developed components will be validated through six major demonstrators targeting applications ranging from quantum computing and sensing to space communication systems and low-noise microwave generation.
The potential impact of PATTERN extends across a broad range of fields, including ultra-high-speed telecommunications, optical computing, metrology, and quantum communication. By establishing a comprehensive, open-access PIC platform with standardised design kits, the project aims to lower barriers to entry for the wider photonics industry and accelerate the transition of microwave photonics from research into industrial application.

Microwave Photonics GmbH plays a focused and technically critical role within the consortium. The company contributes its deep expertise in RF photonic components, specifically in the areas of radio-over-fiber (RoF) and antenna-remoting systems, as well as the development of custom-designed THz photonic components. These contributions are directly tied to some of the most technically demanding aspects of the project, bridging the gap between photonic integration and real-world RF and THz system applications.

The PATTERN consortium brings together eleven complementary partners from France, Germany, Belgium, the Netherlands, Cyprus, Switzerland, and the United Kingdom, spanning large industry players, SMEs, and leading research organisations. These include Thales (project coordinator, France), CSEM (co-coordinator, Switzerland), Fraunhofer HHI (Germany), IMEC (Belgium), CNRS (France), Ghent University/IMEC (Belgium), LUCEDA Photonics (Belgium), PHIX (Netherlands), L-UP (France), the University of Cyprus, and University College London (UK), alongside Microwave Photonics GmbH. Partners from the UK and Switzerland receive additional funding through UKRI and the Swiss State Secretariat for Education, Research and Innovation (SERI) respectively.